Flexible PCB

Key Specifications/Special Features:

• Layers: 1 to 4
• Normal base materials: kapton, PI and PET
• Normal base film thickness: 12.5 to 50um for flex
• Normal cover lay thickness: 12 to 25um
• Normal adhesive thickness: 12 to 35um
• Base copper thickness: 1/2 to 1-ounce (RA/ED copper)
• Stiffener materials: PI, PET, FR4 and SUS
• Minimum finished thickness: 0.071mm/0.0028-inch
• Single-sided thickness: 0.127mm/0.005-inch
• Double-sided thickness: 0.305mm/0.012-inch (4 layers)
• Minimum drill diameter: 0.15mm/0.006-inch
• Minimum line width/spacing: 0.05mm/0.002-inch
• Minimum bonding pitch: 0.10mm/0.004-inch (center-to-center)
• Minimum SMT pitch: 0.40mm/0.016-inch (center-to-center)
• Surface finishing: soft gold over nickel
• For ultrasonic bonding, thermal sonic bonding, hot air solder leveling, immersion tin, silver ink or carbon ink printing and organic solder ability preservative (ENTEK)
• Solder mask: liquid photo imaginable
• Component marking: white or other color per request
• Outline fabrication: precision punching
• General tolerances:
  • Minimum hole diameter: ± 0.05mm
  • Minimum pattern registration: ± 0.05mm
  • Minimum solder mask registration: ± 0.075mm
• General capabilities:
  • Minimum annular ring: 0.025mm
  • Minimum solder mask bridge: 0.1mm
  • Gold-plated thickness: 0.025 to 3um
  • Immersion gold thickness: 0.025 to 0.6um
• Twist and warp: ≤ 1%
• E-testing:
  • Voltage: 24 to 300V
  • Continuity: 5 to 100Ω
• Flying probe E-tester and AOI are available
• Maximum panel size: 250 x 500mm/9.842 x 19.685 inches

Payment Details: