PCBs

Key Specifications/Special Features:

• Layers: 1 to 12
• Normal base materials: BT, G10, FR4 and high Tg FR4
• Normal base thickness: 0.1 to 3.2mm
• Normal base film thickness: N/A
• Normal coverlay thickness: N/A
• Normal adhesive thickness: N/A
• Base copper thickness:
  • Normal: 1/2 to 1-ounce
  • Special order: 1/3 to 3-ounce
• Stiffener materials: N/A
• Minimum finished thickness:
  • Double-sided: 0.13mm/0.005-inch
  • 4 layers: 0.35mm/0.014-inch
  • 6 layers: 0.50mm/0.020-inch
• Maximum panel size: 406 x 610mm/16-inch x 24-inch
• Minimum drill diameter: 0.15mm/0.006-inch
• Aspect ratio: 6:1
• Blind or buried vias: yes
• Minimum line width/spacing: 0.05mm/0.002-inch
• Minimum bonding pitch: 0.10mm/0.004-inch (center-to-center)
• Minimum SMT pitch: 0.40mm/0.016-inch (center-to-center)
• Surface finishing:
  • Plated soft gold over nickel for ultrasonic bonding
  • Plated soft gold over nickel for thermal sonic bonding
  • Plated selective hard gold over nickel for connector
  • Electro less nickel and immersion gold
  • Hot air solders leveling
  • Immersion tin
  • Silver ink or carbon ink printing
  • Organic solder ability preservative (Entek)
  • Solder mask: liquid photoimageable
• Component marking: white or other colors as per request
• Outline fabrication: precision punching, CNC routing, CNC V-scoring and CNC milling cavity
• General tolerances:
  • Minimum hole diameter: ± 0.05mm
  • Minimum hole position: ± 0.05mm
  • Minimum pattern registration: ± 0.05mm
  • Minimum solder mask registration: ± 0.075mm
• General capabilities:
  • Minimum annular ring: 0.025mm
  • Minimum solder mask bridge (LPI): 0.1mm
  • Gold-plated thickness: 0.025 to 3um
  • Immersion gold thickness: 0.025 to 0.6um
  • Twist and warp: ≤ 1%
  • E-testing voltage: 24 to 300V
  • Continuity: 5 to 100Ω
  • Flying probe E-tester and AOI available

Payment Details: